CRS14 2009-04-20 1 toshiba schottky barrier rectifier schottky barrier type CRS14 switching mode power supply applications portable equipment battery applications ? forward voltage: v fm = 0.49 v (max) @ i f = 2.0 a ? average forward current: i f (av) = 2.0 a ? repetitive peak reverse voltage: v rrm = 30 v ? suitable for high-density board a ssembly due to the use of a small surface-mount package, ?s-flat tm ? absolute maximum ratings (ta = 25c) characteristics symbol rating unit repetitive peak reverse voltage v rrm 30 v average forward current i f (av) 2.0 (note 1) a peak one cycle surge forward current (non-repetitive) i fsm 30 (50 hz) a junction temperature t j ? 40 to 150 c storage temperature t stg ? 40 to 150 c note 1: ta = 64c : device mount ed on a ceramic board board size : 50 mm 50 mm soldering size : 2 mm 2 mm board thickness : 0.64 mm rectangular waveform ( = 180), v r = 15 v note 2: using continuously under heavy loads (e.g. t he application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temper ature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). unit: mm anode cathode 0.16 0 ~ 0.1 0.65 0.2 0.65 0.2 3.5 0.2 2.6 0.1 0.98 0.1 0.9 0.1 + 0.2 ? 0.1 1.6 jedec ? jeita ? toshiba 3-2a1a weight: 0.013 g (typ.)
CRS14 2009-04-20 2 electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit v fm (1) i fm = 0.1 a (pulse test) ? 0.35 ? v fm (2) i fm = 1.0 a (pulse test) ? 0.415 ? peak forward voltage v fm (3) i fm = 2.0 a (pulse test) ? 0.44 0.49 v i rrm (1) v rrm = 5 v (pulse test) ? 0.8 ? repetitive peak reverse current i rrm (2) v rrm = 30 v (pulse test) ? 10 50 a junction capacitance c j v r = 10 v, f = 1.0 mhz ? 90 ? pf device mounted on a ceramic board (board size: 50 mm 50 mm) (soldering land: 2 mm 2 mm) (board thickness: 0.64 mm) ? ? 70 thermal resistance (junction to ambient) r th (j-a) device mounted on a glass-epoxy board (board size: 50 mm 50 mm) (soldering land: 6 mm 6 mm) (board thickness: 1.6 mm) ? ? 140 c/w thermal resistance (junction to lead) r th (j- ? ) ? ? ? 20 c/w
CRS14 2009-04-20 3 marking abbreviation code part no. sd CRS14 standard soldering pad handling precaution schottky barrier diodes have reverse current characteristics compared to other diodes. there is a possibility sbd may cause ther mal runaway when it is used under high temperature or high voltage. please take forward and reverse loss into consideration during design. the absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,even for a moment. do not exceed any of these ratings. the followi ng are the general derating methods that we recommend when you design a circuit with a device. v rrm : use this rating with reference to the above. v rrm has a temperature coefficient of 0.1%/c. take this temperature coefficient into account designing a device at low temperature. i f(av) : we recommend that the worst case current be no greater than 80% of the absolute maximum rating of i f(av) and t j be below 120c. when using this device, take the margin into consideration by using an allowable tamax-i f(av) curve. i fsm : this rating specifies the non-repetitive peak curren t. this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. t j : derate this rating when using a device in order to ensure high reliability. we recommend that the device be used at a t j of below 120c. thermal resistance between junction and ambient fluctuat es depending on the device?s mounting condition. when using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. 2.8 1.2 1.2 unit: mm part no.(or abbreviation code) cathode mark and lot code a node cathode sd
CRS14 2009-04-20 4 10 1 100 1000 0.001 0.01 0.1 1 10 100 3 5 30 50 300 500 0.0 0 40 160 20 60 120 100 80 = 60 120 dc 180 140 0.8 1.2 2.0 2.4 0.4 1.6 2.8 3.2 0.0 0 0.2 0.8 0.8 1.2 2.0 2.4 0.6 0.4 1.6 0.4 = 60 120 dc 180 2.8 3.2 1.2 1.0 instantaneous forward voltage v f (v) i f ? v f instantaneous forward current i f (a) average forward current i f (av) (a) average forward power dissipation p f (av) (w) average forward current i f (av) (a) ta m a x ? i f (av) ceramic substrate (substrate size: 50 mm 50 mm, soldering land: 2 mm 2 mm) maximum allowable temperature ta m a x ( c ) average forward current i f (av) (a) maximum allowable temperature ta m a x ( c ) average forward current i f (av) (a) t ? max ? i f (av) maximum allowable lead temperature t ? max (c) p f (av) ? i f (av) ta m a x ? i f (av) glass-epoxy substrate (substrate size: 50 mm 50 mm, soldering land: 6 mm 6 mm) 360 0 conduction angle rectangular waveform device mounted on a ceramic board: board size: 50 mm 50 mm soldering land: 2.0 mm 2.0 mm board thickness: 0.64 mm device mounted on a glass-epoxy board: board size: 50 mm 50 mm soldering land: 6.0 mm 6.0 mm board thickness: 1.6 mm time t (s) r th (j-a) ? t transient thermal impedance r th (j-a) (c/w) 10 0 0.3 0.1 0.2 0.8 0.6 0.4 0.5 0.7 1 0.1 0.01 0.3 0.03 3 t j = 150c 75c 25c 125c 0.0 0 40 160 20 60 120 100 80 = 60 120 dc 180 140 0.8 1.2 2.0 2.4 0.4 1.6 2.8 3.2 360 0 v r = 15 v i f ( av ) conduction angle rectangular waveform 360 0 v r = 15 v i f ( av ) conduction angle rectangular waveform 0.0 0 40 160 20 60 120 100 80 = 60 120 dc 180 140 0.8 1.2 2.0 2.4 0.4 1.6 2.8 3.2 360 0 v r = 15 v i f ( av ) conduction angle rectangular waveform
CRS14 2009-04-20 5 0.1 8 0 16 12 24 20 28 0.2 0.3 0.4 0.5 0.6 0 4 0.7 0.8 dc 300 240 180 120 60 0 20 120 80 40 60 100 100 1 0.001 0.0001 0.01 10 140 v r = 30 v 20 v 10 v 5 v 3 v 0.1 160 pulse test number of cycles surge forward current (non-repetitive) peak surge forward current i fsm (a) reverse voltage v r (v) c j ? v r (typ.) junction capacitance c j (pf) junction temperature t j (c) i r ? t j (typ.) reverse current i r (ma) reverse voltage v r (v) p r (av) ? v r (typ.) average reverse power dissipation p r (av) (w) 360 0 v r rectangular waveform conduction angle t j = 150c 40 30 20 10 0 10 1 3 30 100 5 50 ta = 25c f = 50 hz 30 1 100 1000 300 500 50 3 10 30 5 50 100 f = 1 mhz ta = 25c 10
CRS14 2009-04-20 6 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before creating and producing des igns and using, customers mus t also refer to and comply with (a) the latest versions of all re levant toshiba information, including without limitation, this d ocument, the specifications, the data sheets and applic ation notes for product and the precautions and conditions set forth in the ?tosh iba semiconductor reliability handbook? and (b) t he instructions for the application that product will be used with or for. custome rs are solely responsible for all aspects of t heir own product design or applications, incl uding but not limited to (a) determining th e appropriateness of the use of this product in such design or applications; (b) evaluating and det ermining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? 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